Diamond Grinding Pads for EZ Change Plate of HTC Floor Grinders - Bar Segments
Diamond Grinding Pads for EZ Change Plate of HTC Floor Grinders - Bar Segments
Diamond pad with 1 or 2pcs metal bond bar segments for EZ change plate of HTC grinding machines, suitable for general (concrete, terrazzo, stone) floor grinding use, while mostly they are used for paint, glue, epoxy removal and floor coating.
Metal bond diamond segment has high strength, excellent wear resistance, and a low friction coefficient, it also has high grinding efficiency and low grinding force generates less heat in the grinding process.
The bar segment is ideal for removing heavy coating, it is extremely aggressive leaving and deep to medium scratch pattern, taking the floor from coarsely structured surface to pre-polishing.
Advantage: very efficient for the toughest situations such as the removal of very persistent coating, and the high diamond concentration provides for a faster grinding rate while the high quality of the diamonds provides longer grinding life.
Features: excellent wear resistance, lower cost, better surface finish etc.
| | |
Code No. | Segment No. | Segment Size | Segment Bond | Grit No. | Connection |
CD-DGP-HTC-01-1 | 1 | 40x10x10mm | Soft Medium Hard | #6, #16, #20, #25, #30, #40, #50, #60, #80, #100, #120, #150, #170, #200 | HTC EZ change plate |
CD-DGP-HTC-01-2 | 2 |
The about specifications & photos is for reference, special logo, segment size may be available as per demand.
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